Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc

Product Details
Customization: Available
Metal Coating: Tin
Mode of Production: SMT
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  • Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
  • Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
  • Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
  • Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
  • Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
  • Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
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Basic Info.

Model NO.
Cm4101016
Layers
Single-Layer
Base Material
PCB
Certification
RoHS, CCC
Customized
Non-Customized
Condition
New
Form Factor
55mm * 40mm
Processor
Broadcom Bcm2711
Input Power
DC 5V
Operating Temperature
0 ~ 80 ºC
Transport Package
Air Express
Specification
1 piece/box
Trademark
CENTURY SOLUTIONS
Origin
GB
HS Code
8473309000
Production Capacity
100000

Product Description

Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
Raspberry Pi Compute Module 4 harnesses the compute power of the popular Raspberry Pi 4 Model B, bringing it to a smaller form factor suitable for integration into products. Key features include a high-performance 64-bit quad-core processor, dual-display support

at resolutions up to 4K, hardware video decode at up to 4Kp60, up to 8GB of RAM, Gigabit Ethernet, USB 2.0, dual camera interfaces, and PCIe Gen 2 x1 interface. The optional dual-band 2.4/5.0GHz wireless LAN and Bluetooth 5.0 have modular compliance certification. This allows the board to be designed into end products with

significantly reduced compliance testing, improving both cost and time to market. Either the onboard antenna or an external antenna kit can be used. Compute Module 4 has optional onboard eMMC of 8GB, 16GB or 32GB.

Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g EmmcIntegrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g EmmcIntegrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
 

Compute Module 4
Part Number Wireless Ram eMMC  
CM4001000 No 1GB 0GB (Lite)  
CM4001008 8GB  
CM4001016 16GB  
CM4001032 32GB  
CM4002000 2GB 0GB (Lite)  
CM4002008 8GB  
CM4002016 16GB  
CM4002032 32GB  
CM4004000 4GB 0GB (Lite)  
CM4004008 8GB  
CM4004016 16GB  
CM4004032 32GB  
CM4008000 8GB 0GB (Lite)  
CM4008008 8GB  
CM4008016 16GB  
CM4008032 32GB  
CM4101000 Yes 1GB 0GB (Lite)  
CM4101008 8GB  
CM4101016 16GB  
CM4101032 32GB  
CM4102000 2GB 0GB (Lite)  
CM4102008 8GB  
CM4102016 16GB  
CM4102032 32GB  
CM4104000 4GB 0GB (Lite)  
CM4104008 8GB  
CM4104016 16GB  
CM4104032 32GB  
CM4108000 8GB 0GB (Lite)  
CM4108008 8GB  
CM4108016 16GB  
CM4108032 32GB

Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
Integrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g EmmcIntegrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g EmmcIntegrated Circuits Cm4101016 Raspberry Pi Compute Module 4 Wireless 1g RAM 16g Emmc
 
FAQ
1.Do I need a heatsink when I design a system based on Raspberry Pi Compute Module 4?
A: Yes. You have to consider the heat of Compute Module 4 in your design because there are multiple hot components on Compute Module 4- CPU, PMU Chip and Wireless Module. If your system operate at 1.5GHz, full load and operating temperature at 25°C, the temperature of CPU is around +80°C. If the operating temperature is higher, the temperature of CPU will exceed +85°C.
Although there are no risk to damage the CPU when your system work at higher temperature, CPU will lower its operating frequency, the system will operate at protected mode, the processing performance is lower.
Normally if the system continues to operate at high temperature, the product life and system stability will be reduced.
So the thermal design should be considered.

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